{"id":12248,"date":"2026-06-12T05:40:17","date_gmt":"2026-06-12T05:40:17","guid":{"rendered":"https:\/\/nylonplastic.com\/lcp-liquid-crystal-polymer-vectra-zenite-properties-guide\/"},"modified":"2026-06-12T05:40:17","modified_gmt":"2026-06-12T05:40:17","slug":"lcp-liquid-crystal-polymer-vectra-zenite-properties-guide","status":"publish","type":"post","link":"https:\/\/nylonplastic.com\/zh\/lcp-liquid-crystal-polymer-vectra-zenite-properties-guide\/","title":{"rendered":"LCP Liquid Crystal Polymer Guide: Type I II III Grades, Vectra Zenite Properties, and LCP vs PPS vs PEEK"},"content":{"rendered":"

What Is LCP?<\/h2>\n

LCP (Liquid Crystal Polymer) occupies a unique position in the engineering polymers hierarchy. It is not a nylon, not a polyester in the conventional sense, and not a filled compound \u2014 LCP is a wholly aromatic polyester that forms ordered, rod-like molecular structures in the melt state. When LCP flows into a mold, those rigid molecular rods align along the flow direction, giving the molded part an effect analogous to self-reinforcement: tensile modulus and strength along the flow axis far exceed what the resin’s density and composition suggest.<\/p>\n

The practical result: HDT values exceeding 300\u00b0C, thermal expansion coefficients comparable to steel (1\u20133 \u00d7 10\u207b\u2076\/\u00b0C), wall-thickness capability down to 0.1 mm, and inherent UL94 V-0 flammability without additive loading. No other thermoplastic combines this set of properties at LCP’s price point.<\/p>\n

For engineers and buyers searching for LCP datasheets, Vectra vs Zenite grade comparisons, LCP vs PPS vs PEEK selection guidance, or LCP thin-wall molding parameters,<\/strong> this page consolidates the key specifications, grades, processing windows, and application data.<\/p>\n

LCP Type Classification: I, II, III<\/h2>\n

The LCP family is divided into three types based on heat deflection temperature (HDT), which is driven by the monomer chemistry and resulting backbone rigidity.<\/p>\n

\n\n\n\n\n\n\n\n
\u985e\u578b<\/th>\nHDT Range (\u00b0C)<\/th>\nBase Chemistry<\/th>\nExample Brand<\/th>\nKey Feature<\/th>\nTypical Use<\/th>\n<\/tr>\n<\/thead>\n
Type I<\/strong><\/td>\n250\u2013350<\/td>\nPara-hydroxybenzoic acid + biphenol + terephthalic acid<\/td>\nXydar (Solvay), Ekonol<\/td>\nHighest heat resistance, can survive 300\u00b0C+ continuous<\/td>\nOvenware, aerospace, high-temp connectors<\/td>\n<\/tr>\n
Type II<\/strong><\/td>\n180\u2013240<\/td>\nPara-hydroxybenzoic acid + 6-hydroxy-2-naphthoic acid<\/td>\nVectra (Celanese), Zenite (Celanese)<\/td>\nBest balance of processability, properties, and cost<\/td>\nElectronics connectors, SMT, 5G components<\/td>\n<\/tr>\n
Type III<\/strong><\/td>\n60\u2013210<\/td>\nEthylene terephthalate + para-hydroxybenzoic acid<\/td>\nX7G, Rodrun<\/td>\nLowest cost, lowest heat \u2014 used where flow matters more than T<\/td>\nThin-wall consumer goods, fibers<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n

In practice, Type II (Vectra\/Zenite) dominates commercial injection molding<\/strong> \u2014 roughly 80% of LCP consumption falls here. Type I is reserved for the highest-temperature applications where cost is secondary. Type III has largely been displaced by Type II as processors gained experience with the higher-temperature grades.<\/p>\n

LCP GF30 Typical Properties<\/h2>\n
\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
\u8ca1\u7522<\/th>\nTest Method<\/th>\nLCP GF30 (Type II)<\/th>\nLCP Unfilled (Type II)<\/th>\n<\/tr>\n<\/thead>\n
\u5bc6\u5ea6<\/td>\nISO 1183<\/td>\n1.62 g\/cm\u00b3<\/td>\n1.40 g\/cm\u00b3<\/td>\n<\/tr>\n
\u7194\u89e3\u6eab\u5ea6<\/td>\nISO 11357<\/td>\n280\u00b0C<\/td>\n280\u00b0C<\/td>\n<\/tr>\n
HDT @ 1.80 MPa<\/td>\nISO 75<\/td>\n240\u2013260\u00b0C<\/td>\n190\u2013210\u00b0C<\/td>\n<\/tr>\n
Tensile Modulus (flow direction)<\/td>\nISO 527<\/td>\n15,000 MPa<\/td>\n10,000 MPa<\/td>\n<\/tr>\n
Tensile Modulus (transverse)<\/td>\nISO 527<\/td>\n5,000 MPa<\/td>\n3,000 MPa<\/td>\n<\/tr>\n
Tensile Strength (flow direction)<\/td>\nISO 527<\/td>\n180 MPa<\/td>\n180 MPa<\/td>\n<\/tr>\n
Tensile Strength @ 200\u00b0C<\/td>\nISO 527<\/td>\n~150 MPa<\/td>\nN\/A<\/td>\n<\/tr>\n
\u65b7\u88c2\u4f38\u9577\u7387<\/td>\nISO 527<\/td>\n1.5\u20132.5%<\/td>\n1.5\u20133.0%<\/td>\n<\/tr>\n
\u5f4e\u66f2\u6a21\u91cf<\/td>\nISO 178<\/td>\n13,000 MPa<\/td>\n9,000 MPa<\/td>\n<\/tr>\n
Charpy Notched Impact +23\u00b0C<\/td>\nISO 179\/1eA<\/td>\n15\u201325 kJ\/m\u00b2<\/td>\n20\u201330 kJ\/m\u00b2<\/td>\n<\/tr>\n
CTE (flow direction)<\/td>\nISO 11359<\/td>\n1\u20133 \u00d7 10\u207b\u2076\/\u00b0C<\/td>\n1\u20135 \u00d7 10\u207b\u2076\/\u00b0C<\/td>\n<\/tr>\n
CTE (transverse)<\/td>\nISO 11359<\/td>\n15\u201330 \u00d7 10\u207b\u2076\/\u00b0C<\/td>\n25\u201350 \u00d7 10\u207b\u2076\/\u00b0C<\/td>\n<\/tr>\n
Water Absorption (23\u00b0C, 24h)<\/td>\nISO 62<\/td>\n< 0.05%<\/td>\n< 0.05%<\/td>\n<\/tr>\n
Flammability (UL94)<\/td>\nUL94<\/td>\nV-0 @ 0.2 mm<\/td>\nV-0 @ 0.2 mm<\/td>\n<\/tr>\n
\u6a21\u5177\u6536\u7e2e\uff08\u6d41\u91cf\uff09<\/td>\nISO 294-4<\/td>\n0.0\u20130.2%<\/td>\n0.0\u20130.3%<\/td>\n<\/tr>\n
Mold Shrinkage (transverse)<\/td>\nISO 294-4<\/td>\n0.4\u20130.7%<\/td>\n0.5\u20130.9%<\/td>\n<\/tr>\n
Dielectric Constant @ 1 GHz<\/td>\nIEC 60250<\/td>\n3.5\u20134.0<\/td>\n3.0\u20133.5<\/td>\n<\/tr>\n
Dissipation Factor @ 1 GHz<\/td>\nIEC 60250<\/td>\n0.005\u20130.010<\/td>\n0.003\u20130.008<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n

LCP vs. PPS vs. PEEK: High-Temperature Thermoplastics Showdown<\/h2>\n

LCP, PPS, and PEEK are the three most frequently cross-shopped materials in the >200\u00b0C thermoplastic space. The table below shows why none of them displaces the others entirely \u2014 each material has a performance-cost profile that matches a specific application envelope.<\/p>\n

\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
\u8ca1\u7522<\/th>\nLCP GF30<\/th>\nPPS GF40<\/th>\nPEEK 30% GF<\/th>\n<\/tr>\n<\/thead>\n
\u5bc6\u5ea6<\/strong><\/td>\n1.62 g\/cm\u00b3<\/td>\n1.65 g\/cm\u00b3<\/td>\n1.49 g\/cm\u00b3<\/td>\n<\/tr>\n
HDT @ 1.80 MPa<\/strong><\/td>\n240\u2013260\u00b0C (Type II)
300\u2013350\u00b0C (Type I)<\/td>\n		265\u00b0C<\/td>\n315\u00b0C<\/td>\n<\/tr>\n
Continuous Use Temp<\/strong><\/td>\n200\u2013240\u00b0C (Type II)
260\u2013300\u00b0C (Type I)<\/td>\n		200\u2013220\u00b0C<\/td>\n250\u00b0C<\/td>\n<\/tr>\n
CTE (flow direction)<\/strong><\/td>\n1\u20133 \u00d7 10\u207b\u2076\/\u00b0C<\/td>\n15\u201325 \u00d7 10\u207b\u2076\/\u00b0C<\/td>\n15\u201325 \u00d7 10\u207b\u2076\/\u00b0C<\/td>\n<\/tr>\n
Tensile Modulus @ 200\u00b0C<\/strong><\/td>\n~10,000 MPa<\/td>\n~12,000 MPa<\/td>\n~8,000 MPa<\/td>\n<\/tr>\n
Tensile Strength @ 200\u00b0C<\/strong><\/td>\n~150 MPa<\/td>\n~130 MPa<\/td>\n~120 MPa<\/td>\n<\/tr>\n
Impact Toughness @ RT<\/strong><\/td>\nLow (15\u201325 kJ\/m\u00b2)<\/td>\nModerate (25\u201340 kJ\/m\u00b2)<\/td>\nHigh (50\u201370 kJ\/m\u00b2)<\/td>\n<\/tr>\n
Flammability<\/strong><\/td>\nV-0 inherent (no additives)<\/td>\nV-0 (with additives)<\/td>\nV-0 (with additives)<\/td>\n<\/tr>\n
Water Absorption<\/strong><\/td>\n< 0.05%<\/td>\n0.03%<\/td>\n0.1%<\/td>\n<\/tr>\n
\u8010\u5316\u5b78\u6027<\/strong><\/td>\nExcellent (acids, solvents)<\/td>\nExcellent (nearly universal below 200\u00b0C)<\/td>\nExcellent (except strong acids)<\/td>\n<\/tr>\n
Weld Line Strength<\/strong><\/td>\nPoor (inherently weak)<\/td>\nFair<\/td>\n\u826f\u597d<\/td>\n<\/tr>\n
Wall Thickness Minimum<\/strong><\/td>\n0.1 mm<\/td>\n0.3 mm<\/td>\n0.5 mm<\/td>\n<\/tr>\n
Processing Temp<\/strong><\/td>\n300\u2013350\u00b0C<\/td>\n320\u2013340\u00b0C<\/td>\n380\u2013400\u00b0C<\/td>\n<\/tr>\n
Mold Temp<\/strong><\/td>\n80\u2013120\u00b0C<\/td>\n130\u2013150\u00b0C<\/td>\n170\u2013200\u00b0C<\/td>\n<\/tr>\n
Relative Cost \/ kg<\/strong><\/td>\n$$$<\/td>\n$$<\/td>\n$$$$<\/td>\n<\/tr>\n
\u6700\u9069\u5408<\/strong><\/td>\nUltra-thin-wall electronics, CTE-critical, SMT<\/td>\nChemical plant, hot water, structural<\/td>\nMaximum toughness, medical implants, structural aerospace<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n

Decision Rules<\/h3>\n
    \n
  • Choose LCP when:<\/strong> You need CTE near steel (1\u20133 ppm\/\u00b0C), walls thinner than 0.3 mm, or inherent V-0 without property trade-offs. Electronics connectors, SIM trays, and 5G antenna substrates are LCP’s home turf.<\/li>\n
  • Choose PPS when:<\/strong> Chemical resistance is paramount (especially hot water, steam, or aggressive acids at 150\u00b0C+), you need better toughness than LCP, and CTE is less critical. PPS is also roughly 30\u201340% cheaper per kilogram than LCP.<\/li>\n
  • Choose PEEK when:<\/strong> Toughness is non-negotiable, continuous use approaches 250\u00b0C, or biocompatibility is required. PEEK is the only option in this group for load-bearing medical implants, and it tolerates steam sterilization better than either LCP or PPS.<\/li>\n<\/ul>\n

    LCP Commercial Grade Selector<\/h2>\n
    \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
    Manufacturer<\/th>\nBrand<\/th>\n\u7b49\u7d1a<\/th>\nGF %<\/th>\n\u985e\u578b<\/th>\nKey Feature<\/th>\nTypical Application<\/th>\n<\/tr>\n<\/thead>\n
    Celanese<\/td>\nVectra<\/td>\nA130<\/td>\n30%<\/td>\nII<\/td>\nGeneral-purpose GF30, standard flow<\/td>\nConnectors, bobbins, coil forms<\/td>\n<\/tr>\n
    Celanese<\/td>\nVectra<\/td>\nE130i<\/td>\n30%<\/td>\nII<\/td>\nImproved weld-line strength, higher toughness<\/td>\nComplex connector geometries<\/td>\n<\/tr>\n
    Celanese<\/td>\nVectra<\/td>\nA150<\/td>\n50%<\/td>\nII<\/td>\nMaximum stiffness, lowest shrinkage<\/td>\nHigh-rigidity structural electronics<\/td>\n<\/tr>\n
    Celanese<\/td>\nVectra<\/td>\nA230<\/td>\n30% carbon fiber<\/td>\nII<\/td>\nConductive, high stiffness<\/td>\nESD-sensitive electronics<\/td>\n<\/tr>\n
    Celanese<\/td>\nVectra<\/td>\nE820i Pd<\/td>\n40% (GF+mineral)<\/td>\nII<\/td>\nPlatable grade, LDS-compatible<\/td>\n3D-MID circuits, antenna substrates<\/td>\n<\/tr>\n
    Celanese<\/td>\nVectra<\/td>\nE830i Pd<\/td>\n30% GF<\/td>\nII<\/td>\nPlatable, FDA compliant<\/td>\nMedical device housings<\/td>\n<\/tr>\n
    Celanese<\/td>\nZenite<\/td>\n6130L<\/td>\n30%<\/td>\nII<\/td>\nLow warp, balanced flow<\/td>\nSMT connectors, DDR sockets<\/td>\n<\/tr>\n
    Celanese<\/td>\nZenite<\/td>\n6145L<\/td>\n45%<\/td>\nII<\/td>\nLow warp, high stiffness<\/td>\nLong, thin connectors<\/td>\n<\/tr>\n
    Polyplastics<\/td>\nLaperos<\/td>\nA130<\/td>\n30%<\/td>\nII<\/td>\nStandard GF30, high flow<\/td>\nConsumer electronics<\/td>\n<\/tr>\n
    Solvay<\/td>\nXydar<\/td>\nG-930<\/td>\n30%<\/td>\nI<\/td>\nType I GF30 \u2014 300\u00b0C+ HDT<\/td>\nOven components, aerospace connectors<\/td>\n<\/tr>\n
    Solvay<\/td>\nXydar<\/td>\nG-945<\/td>\n45%<\/td>\nI<\/td>\nType I max stiffness<\/td>\nHigh-temp structural<\/td>\n<\/tr>\n
    Sumitomo<\/td>\nSUMIKASUPER<\/td>\nE6000<\/td>\n30%<\/td>\nII<\/td>\nUltra-low dielectric for 5G<\/td>\n5G antenna substrates, mmWave<\/td>\n<\/tr>\n
    Toray<\/td>\nSiveras<\/td>\nLX70G30<\/td>\n30%<\/td>\nII<\/td>\nImproved toughness GF30<\/td>\nUSB-C connectors, camera modules<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n

    Processing LCP: Injection Molding Parameters<\/h2>\n
    \n\n\n\n\n\n\n\n\n\n\n
    \u53c3\u6578<\/th>\n\u63a8\u85a6\u503c<\/th>\n\u6ce8\u610f\u4e8b\u9805<\/th>\n<\/tr>\n<\/thead>\n
    Pre-drying<\/td>\n140\u2013160\u00b0C for 4 hours<\/td>\nDesiccant dryer required. Target moisture < 0.01%<\/td>\n<\/tr>\n
    Melt Temperature<\/td>\n300\u2013350\u00b0C<\/td>\nType II grades; Type I requires 350\u2013400\u00b0C<\/td>\n<\/tr>\n
    \u6a21\u5177\u6eab\u5ea6<\/td>\n80\u2013120\u00b0C<\/td>\nLower than PPA or PEEK \u2014 water-heated molds often sufficient<\/td>\n<\/tr>\n
    Injection Speed<\/td>\n\u5feb\u901f<\/td>\nLCP solidifies rapidly \u2014 fill speed is critical for thin walls<\/td>\n<\/tr>\n
    Holding Pressure<\/td>\n40\u201360 MPa<\/td>\nLCP shrinkage is near-zero in flow direction; pack lightly<\/td>\n<\/tr>\n
    Residence Time<\/td>\nMinimize (\u2264 10 min)<\/td>\nLCP is thermally stable but extended residence reduces properties<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n

    Critical processing insights:<\/strong><\/p>\n

      \n
    • Weld lines are the Achilles’ heel:<\/strong> LCP’s highly oriented molecular structure creates inherently weak weld lines \u2014 strength at a weld line can be 30\u201350% of the bulk value. Gate placement is more consequential for LCP than for any other engineering thermoplastic. When possible, design parts to avoid weld lines in load-bearing regions, or use multi-gate sequential valve gating to knit fronts under pressure.<\/li>\n
    • Drying is mandatory:<\/strong> Although LCP absorbs almost no water at room temperature, any surface moisture on pellets hydrolyzes the polymer at 330\u00b0C. The 0.01% moisture target is stricter than for most engineering polymers.<\/li>\n
    • Anisotropy is designed-in:<\/strong> LCP’s mechanical properties are inherently anisotropic \u2014 strong in the flow direction, weaker transversely. Part design must account for this. Where isotropy is needed, consider mineral-filled or specialty grades, but expect a stiffness penalty.<\/li>\n
    • Low shrinkage, high precision:<\/strong> Near-zero shrinkage in the flow direction means LCP molds can hold extraordinarily tight tolerances \u2014 but this also means the mold cavity must be cut to essentially final dimensions. No “sizing factor” allowance like with polyolefins.<\/li>\n
    • Fast cycle times:<\/strong> LCP solidifies almost instantly upon contacting the mold wall. Cycle times of 2\u20135 seconds for small electronic connectors are routine \u2014 this is LCP’s single greatest processing advantage.<\/li>\n<\/ul>\n

      Key LCP Applications<\/h2>\n
      \n\n\n\n\n\n\n\n\n\n\n\n
      \u7522\u696d<\/th>\n\u61c9\u7528<\/th>\nDriving Property<\/th>\n<\/tr>\n<\/thead>\n
      \u6d88\u8cbb\u6027\u96fb\u5b50\u7522\u54c1<\/td>\nSIM card trays, USB-C connectors, DDR memory sockets, camera module housings<\/td>\nThin-wall (0.1\u20130.3 mm), V-0, survives reflow, CTE match to copper<\/td>\n<\/tr>\n
      5G \/ Telecommunications<\/td>\nAntenna substrates, mmWave lens arrays, base station connector bodies<\/td>\nLow Dk\/Df at GHz frequencies, dimensional stability<\/td>\n<\/tr>\n
      \u6c7d\u8eca<\/td>\nIgnition coil bobbins, transmission speed sensors, relay bases<\/td>\nHeat resistance, oil resistance, electrical insulation<\/td>\n<\/tr>\n
      \u91ab\u7642<\/td>\nSurgical instrument handles, dental tool bodies, catheter components<\/td>\nSteam sterilizable, chemical resistance, dimensional precision<\/td>\n<\/tr>\n
      Fiber Optics<\/td>\nOptical fiber connectors (MT, MPO ferrules), alignment sleeves<\/td>\nCTE match to glass fiber, micromolding precision<\/td>\n<\/tr>\n
      \u822a\u592a<\/td>\nHigh-temperature connector inserts, waveguide components, radome structures<\/td>\nType I grades: 300\u00b0C+ service, low outgassing, lightweight<\/td>\n<\/tr>\n
      \u5de5\u696d\u7d1a<\/td>\nPump wear rings, chemical valve seats, bearing cages (high-temp)<\/td>\nChemical resistance at 150\u00b0C+, dimensional stability in aggressive media<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n

      LCP Limitations<\/h2>\n
        \n
      • Weld line weakness:<\/strong> This cannot be overstated. If your part has converging melt fronts in a stressed area, LCP is probably not the right material. Weld line strength in LCP is worse than PPS, far worse than PA66.<\/li>\n
      • Low impact toughness:<\/strong> Unfilled and GF LCP grades are inherently brittle. Charpy notched values of 15\u201325 kJ\/m\u00b2 make them unsuitable for snap-fit applications or parts subject to impact loads.<\/li>\n
      • Anisotropic properties:<\/strong> Tensile modulus can vary 3:1 between the flow direction and transverse direction. This is manageable when the mold designer knows it, but problematic if the part was designed for an isotropic material.<\/li>\n
      • Cost:<\/strong> LCP costs 3\u20136\u00d7 a standard PA66 GF30 and roughly 2\u00d7 PPS GF40. You are paying for the unique combination of CTE, thin-wall capability, and inherent V-0.<\/li>\n
      • Limited colorability:<\/strong> LCP is typically black or natural. Light colors are difficult due to the high processing temperatures.<\/li>\n
      • Notch sensitivity:<\/strong> LCP’s sharp notches propagate cracks readily. Avoid sharp internal corners in part design.<\/li>\n<\/ul>\n

        \u5e38\u898b\u554f\u984c<\/h2>\n

        What does LCP stand for in plastics?<\/h3>\n

        LCP stands for Liquid Crystal Polymer. The name comes from the material’s unique behavior: even in the molten state, LCP molecules maintain a degree of orientational order (a “liquid crystalline” phase), unlike conventional polymers whose molecules are randomly coiled when melted. This liquid-crystalline melt structure is what gives LCP its extreme flowability, self-reinforcing properties, and low thermal expansion.<\/p>\n

        What is the difference between LCP Type I, II, and III?<\/h3>\n

        The three types are distinguished by heat deflection temperature (HDT): Type I (250\u2013350\u00b0C, e.g., Xydar) for the highest-temperature applications like aerospace; Type II (180\u2013240\u00b0C, e.g., Vectra, Zenite) for general-purpose electronics and automotive, which represents the majority of commercial LCP consumption; and Type III (60\u2013210\u00b0C, e.g., X7G) which is a lower-cost variant now mostly displaced by Type II.<\/p>\n

        Is LCP better than PEEK?<\/h3>\n

        “Better” depends on the requirement. LCP has higher flow-direction stiffness at 200\u00b0C, lower CTE (1\u20133 vs. 15\u201325 ppm\/\u00b0C), faster cycle times (2\u20135 seconds vs. 30+ seconds), and lower per-kilogram cost than PEEK. PEEK has dramatically better impact toughness (50\u201370 vs. 15\u201325 kJ\/m\u00b2), higher continuous-use temperature (250\u00b0C vs. 200\u2013240\u00b0C), and weld line strength far exceeding LCP. If your part has converging melt fronts under load, choose PEEK. If it’s a thin-wall electronic connector needing CTE match and V-0, LCP wins.<\/p>\n

        Can LCP replace metal?<\/h3>\n

        In specific applications, yes. LCP’s CTE of 1\u20133 \u00d7 10\u207b\u2076\/\u00b0C matches steel and copper better than any other unfilled thermoplastic. This is why LCP has replaced metal in SIM card trays, camera module housings, and optical fiber ferrules \u2014 the part maintains dimensional compatibility with metal and glass components across assembly and operating temperatures.<\/p>\n

        Does LCP absorb water?<\/h3>\n

        No \u2014 and this is one of LCP’s defining advantages. Water absorption is below 0.05%, meaning LCP parts neither swell in humid environments nor require conditioning before use. Combined with its near-zero flow-direction mold shrinkage, this makes LCP the go-to material for parts that must arrive at assembly with tight tolerances regardless of shipping or storage humidity.<\/p>\n

        What is the maximum temperature for LCP?<\/h3>\n

        Type II LCP (Vectra\/Zenite) has a continuous-use rating of 200\u2013240\u00b0C, with short-term excursions to 260\u00b0C for lead-free reflow soldering. Type I LCP (Xydar) can sustain 260\u2013300\u00b0C continuous. The melting point for Type II is approximately 280\u00b0C; for Type I it exceeds 350\u00b0C.<\/p>\n

        Need LCP pellets, Vectra or Zenite datasheets, or help selecting the right LCP grade?<\/strong> We supply GF-carbon, platable, and low-warp LCP grades from Celanese, Polyplastics, and Sumitomo. Contact us with your part geometry, temperature, and electrical requirements.<\/p>\n\t\t\t

        \n\t\t\t