PC/ABS General Purpose Technical Data (Estimated Typical Values)
| Property | Value | Test Standard |
|---|---|---|
| Tensile Strength | 50 – 60 MPa | ISO 527 |
| Flexural Modulus | 2,200 – 2,500 MPa | ISO 178 |
| Notched Impact Strength | 45 – 55 kJ/m² | ISO 180 |
| HDT @1.8 MPa | 105 – 115 °C | ISO 75 |
| Melt Flow Rate (240°C/5kg) | 15 – 25 g/10min | ISO 1133 |
PC/ABS Series Performance Comparison Table (Estimated Typical Values)
| Property | PC/ABS GP | PC/ABS HF | PC/ABS FR (V-0) | PC/ABS GF20 |
|---|---|---|---|---|
| Tensile Strength | 50 – 60 MPa | 48 – 55 MPa | 45 – 55 MPa | 70 – 85 MPa |
| Flexural Modulus | 2,200 – 2,500 MPa | 2,000 – 2,300 MPa | 2,300 – 2,600 MPa | 4,500 – 5,500 MPa |
| Notched Impact Strength | 45 – 55 kJ/m² | 40 – 50 kJ/m² | 25 – 35 kJ/m² | 15 – 25 kJ/m² |
| HDT @1.8 MPa | 105 – 115 °C | 100 – 110 °C | 95 – 105 °C | 115 – 125 °C |
| Melt Flow Rate (240°C/5kg) | 15 – 25 g/10min | 30 – 50 g/10min | 10 – 20 g/10min | 10 – 18 g/10min |
| Flame Rating (UL94) | HB | HB | V-0 | HB |
| Key Profile | Balanced all-rounder | Easy flow for complex parts | Safety compliance | High stiffness |
PC/ABS General Purpose Key Advantages
✅ Exceptional Impact Toughness: Inherits the high impact strength of PC, maintaining good ductility even at low temperatures for reliable product protection.
✅ Superior Heat Resistance & Dimensional Stability: Offers significantly higher heat deflection temperature than pure ABS, ensuring parts remain stable and resist deformation in warm environments.
✅ Excellent Processability & Surface Quality: Overcomes the poor flow of pure PC, allowing for easy injection molding and delivering a surface finish ideal for painting and plating.
Industry Applications:
Explore the PC/ABS Alloy Series in Detail
Click on the links below to view comprehensive technical data, key advantages, and application details for each specific grade.
| Grade | Best For | Overview | Full Details |
|---|---|---|---|
| PC/ABS General Purpose | Applications demanding an optimal balance of impact strength, heat resistance, and processability. | The benchmark alloy grade, offering the classic combination of PC’s toughness and ABS’s ease of processing for a wide range of structural parts. | View PC/ABS GP Full Data Sheet → |
| PC/ABS High Flow | Thin-walled, complex geometry parts requiring excellent filling and surface finish. | Engineered with enhanced melt flow, facilitating the molding of intricate designs and reducing cycle times without sacrificing key mechanical properties. | View PC/ABS HF Full Data Sheet → |
| PC/ABS Flame Retardant (V-0) | Electronic enclosures and components with mandatory fire safety requirements. | A UL94 V-0 rated grade that combines inherent flame retardancy with good impact strength and thermal stability for safe electronic applications. | View PC/ABS FR Full Data Sheet → |
| PC/ABS Reinforced (GF20) | Structural components requiring higher stiffness, dimensional stability, and heat deflection temperature. | Glass fiber reinforced grade that significantly boosts rigidity and creep resistance while maintaining good overall toughness. | View PC/ABS GF20 Full Data Sheet → |
Powering Innovation Across Industries (PC/ABS Series)
| Industry | Key Applications |
|---|---|
| Automotive | Interior trim (instrument panels, pillar covers, glove box doors), exterior components (wheel covers, mirror housings), and connectors requiring heat resistance & aesthetics. Explore Automotive Solutions → |
| Electrical & Electronics | Durable housings for laptops, monitors, printers, power tools, and consumer electronics that demand a balance of impact strength, heat resistance, and good surface finish. Discover E&E Solutions → |
| Consumer Appliances & Tools | Vacuum cleaner bodies, blender and coffee maker housings, power tool grips, and other appliance components needing structural integrity and a premium feel. Explore Consumer Applications → |
| Industrial & Business Equipment | Robust casings for printers, copiers, industrial control panels, and handheld scanners where durability and dimensional stability are critical. See Industrial Uses → |
| Medical & Specialty Devices | Housings for non-implantable medical devices, diagnostic equipment, and specialty enclosures requiring a combination of cleanliness, durability, and compliance. Inquire About Specialty Uses → or Contact for Special Uses → |
How to Choose the Right PC/ABS Grade?
In simple terms:
For most structural applications requiring the best all-around balance of toughness, heat resistance, and cost-effectiveness, choose PC/ABS General Purpose.
For complex, thin-walled designs such as intricate housings or large panels, select PC/ABS High Flow to ensure complete filling and a superior surface.
For safety-critical electrical/electronic parts that must meet flame retardancy standards, specify PC/ABS Flame Retardant (V-0).
For applications where maximum stiffness, minimal deflection, and higher thermal performance are critical, opt for PC/ABS Reinforced (GF20).
Unsure which is perfect for your part? Describe your application to our engineers for a tailored recommendation.
Why Choose Us?
PC/ABS General Purpose FAQ
Q1: What are the main differences between PC/ABS alloy and pure PC or pure ABS?
PC/ABS is designed to combine the best of both. Compared to pure PC, it offers vastly improved melt flow, lower molded-in stress, easier processing of complex parts, and lower cost. Compared to pure ABS, it provides significantly higher heat deflection temperature (HDT) and impact strength, especially at low temperatures. It is an upgraded, more balanced choice.
Q2: What are the most typical applications for PC/ABS General Purpose?
Applications are extensive, including: Automotive Interiors (dashboard components, pillars, glove boxes), Electronics Housings (monitor bezels, printers, small appliances), and structural parts for office equipment and consumer electronics. It is ideal where structural integrity, appearance, and assembly precision are all important.
Q3: What are key processing considerations for PC/ABS?
The two most critical points are: Thorough Drying: The material is hygroscopic. Dry at 80-100°C for 3-4 hours to moisture content <0.02% to prevent splay and strength loss. Melt Temperature Control: The recommended melt temperature range is 230-270°C. Too low causes poor flow; too high may degrade the PC phase. A mold temperature of 50-80°C helps reduce stress.
